Bengaluru. SASMOS HET Technologies, a leading provider of Electrical Wiring Interconnection Systems (EWIS) and aerospace interconnect solutions, has signed a Memorandum of Understanding (MOU) with The ePlane Company (Ubifly Technologies Private Limited) to collaborate on the engineering, design and industrialisation of the Electrical Wiring Interconnection System (EWIS) for the company’s e200X electric vertical takeoff and landing (eVTOL) aircraft.
The agreement was announced during Farnborough International Airshow 2026 and marks another milestone in SASMOS HET Technologies’ continued expansion across advanced aerospace programmes. Through the collaboration, SASMOS will contribute its EWIS engineering and industrialisation expertise to support the development of the e200X.
Under the MoU, the companies intend to collaborate on harness architecture, EWIS engineering, design for manufacturability, prototype evaluation and certification readiness for the e200X programme. The collaboration also establishes a framework to explore broader value-chain opportunities across mission-critical electrical and interconnect systems, supporting the programme’s evolution from development through industrialisation and serial production.
Electrical Wiring Interconnection Systems form the critical electrical network of an aircraft, distributing power and data between propulsion, avionics, flight controls and other onboard systems. For electric aircraft, optimised EWIS architecture plays a vital role in reducing weight, improving reliability and supporting certification.
The e200X is one of India’s most advanced electric vertical takeoff and landing (eVTOL) aircraft programmes, being developed as a modular platform capable of supporting passenger transport, air ambulance, and cargo operations. The partnership forms part of The ePlane Company’s wider strategy to establish a robust supplier ecosystem spanning electrical systems, avionics, composite materials, aerospace fasteners and aircraft interiors.
Chandrashekar H G, Chairman and Managing Director, SASMOS HET Technologies, said, “We are delighted to be collaborating with The ePlane Company on the e200X programme. By contributing our expertise in Electrical Wiring Interconnection Systems engineering and industrialisation, we look forward to helping advance the aircraft’s development towards certification.”
Chinya R Nagesh, CBDO – SASMOS Group, said, “This collaboration reflects SASMOS’ commitment to supporting next-generation aerospace platforms with world-class EWIS engineering and industrialisation capabilities. We look forward to working closely with The ePlane Company as the programme progresses towards certification and future production.”
Govind Ponnappan, Associate Vice President – Head of BD, Contracts and Global Expansion, SASMOS Group, said, “Electrical Wiring Interconnection Systems are fundamental to modern aircraft, particularly electric platforms where weight, reliability and manufacturability are critical. This collaboration demonstrates SASMOS’ capability to support innovative aerospace programmes with advanced engineering and industrialisation expertise, from concept through to production.”
Professor Satya Chakravarthy, Founder and CTO, The ePlane Company, said, “Selecting the right technology partners is fundamental to developing a certifiable aircraft. SASMOS HET Technologies brings valuable expertise in Electrical Wiring Interconnection Systems, strengthening the supplier ecosystem supporting the e200X as we continue progressing towards certification and commercialisation.”
The collaboration reinforces SASMOS HET Technologies’ position as a trusted partner for advanced aerospace Electrical Wiring Interconnection Systems, supporting the development and industrialisation of next generation aircraft programmes.
