SASMOS Signs a Contract with Boeing

To Manufacture subassemblies and wire bundles for Boeing 767 and 767-2C aircraft

Civil Aviation

Bengaluru: Bengaluru-based SASMOS HET Technologies has signed a manufacturing contract with Boeing Commercial Airplanes (BCA) to supply Electrical panels, Shelf Assemblies and Electrical wiring systems for Boeing 767 and 767-2C aircraft. The contract was signed at Boeing’s Everett facility in the US.

As part of this agreement, SASMOS will manufacture and export 238 types of parts and assemblies, including Shelf assemblies, Panels assemblies, Sensor assemblies, and Wire bundles for the Boeing 767 and Boeing 767-2C aircrafts. The production will begin early 2023 at the SAMOS manufacturing facility in Bengaluru. SASMOS won this order among other global players, which is a testimony of the capabilities of Indian aerospace companies to deliver global standards in quality, reliability and project management.

On this occasion, H G Chandrashekar, Chairman & Managing Director, SASMOS HET Technologies Limited said, “We have been constantly providing superior quality products to Boeing with highly consistent delivery performance. SASMOS with its decade long experience has successfully positioned itself to match the sensitive requirements of the aerospace industry. We are committed to quality and minute details to ensure perfection in each product we manufacture.”

He further added, “We believe these contracts are not only helping us establish our potential as an Indian defence and aerospace manufacturer but also pushing us to further spread our footprint in the global Aerospace industry ecosystem.”

SASMOS HET Technologies Limited is a leading design and manufacturing company for Electrical Wiring Interconnection Systems, Electromechanical assemblies & Electronic sub-systems for the Air, Land, Weapon, Marine, Space and Nuclear segments.

SASMOS Defence Systems Division and Fibre Optic Division offer customized electronics, electrical, electro-mechanical mission-critical solutions and fibre optic interconnectivity products for harsh environment applications are the latest in the portfolio.